Features


Thermocool

Mid to high end heat sink and thermal solutions for Enterprise, Industrial, Medical, Military and Aerospace Markets
www.thermocoolcorp.com

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Maxscend Technology

-RF components and IoT ICs.
-RF front Ends, RF switches and LNA. Blue tooth modules.
www.maxscend.com

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Tempo

Tempo Semiconductor, Inc., combines its extensive IP portfolio in ultra-low power mixed-signal, analog and DSP technology to deliver silicon and software-based solutions that enhance our customer’s end-user audio experience.
www.temposemi.com

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Tricor Semiconductor/Avant

Designs, manufactures and provides custom, semi-custom and standard DRAM, SSD and Flash memory products for the PC/notebook, server/storage, net-com, embedded computing, and test equipment OEM markets.
www.tricortechnologies.com

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IMS

IMS is an industry leader in design, development and production of passive electronic components including thick and thin film resistors, attenuators, couplers, thermal management devices and other RF microwave components. READ MORE
www.ims-resistors.com

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GoWin

We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards.
www.gowinsemi.com

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MaxQ

Experts in Developing and Manufacturing Liquid Coldplates. MaxQ is a pioneer and global leader in Friction Stir Welding to create efficient heat transfer products.
www.maxqtechnology.com

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Efficient Power Conversion (EPC)

Leader in enhancement mode Gallium Nitride based power management devices. EPC was the first to introduce enhancement-mode Gallium-Nitride-on-Silicon (eGaN®) FETs as power MOSFET replacements in applications such as servers, wireless power transmission, envelope tracking, RF transmission, Power over Ethernet (PoE), solar micro inverters, energy efficient lighting, and class-D audio amplifiers with device performance many times greater than the best silicon power MOSFETs.
www.epc-co.com